The **ATS-P2-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series designed for cooling localized electronic components like BGA (Ball Grid Array) chips, FPGAs, and microprocessors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm (L x W x H) | | **Fin Type** | Straight Fin | | **Attachment Type** | Push-Pin (2-Loop) | | **Thermal Resistance** | ~21.90 °C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Phase Change Material) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body (The Fin Array) The "heart" of the component is the aluminum fin array. * **Thermal Dissipation:** It increases the surface area available for heat transfer from the electronic chip to the surrounding air. * **Straight Fin Design:** This model utilizes a straight fin geometry, which is optimized for **undirected airflow** or environments where air can flow smoothly through the channels. #### 2. Push-Pin Mounting System Instead of using adhesive tape or screws, this part uses a spring-loaded push-pin mechanism. * **Pressure Management:** The springs ensure consistent pressure (load) is applied to the chip, which is critical for minimizing thermal contact resistance. * **Security:** This provides a more robust mechanical connection than thermal tape, making it suitable for high-vibration environments. #### 3. Thermal Interface Material (TIM) The **C3** in the part number refers to the specific TIM applied to the base. * **T766:** This is a high-performance phase-change material. When the electronic part heats up, the T766 softens and fills the microscopic air gaps between the chip and the heat sink, significantly increasing cooling efficiency. #### 4. Blue Anodized Coating The blue coating is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Emissivity:** Anodized surfaces have higher thermal emissivity compared to bare metal, slightly improving heat radiation. --- ### Typical Applications This component is commonly found on printed circuit boards (PCBs) in the following devices: * **Network Switches/Routers:** Cooling the main processing ASIC. * **Industrial Computers:** Managing heat for embedded CPUs. * **Power Supplies:** Cooling MOSFETs or power regulators.