The **ATS-H1-95-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 40mm x 40mm x 30mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~1.49°C/W (at 200 LFM) | | **Fin Style** | Straight Fin (High Density) | --- ### 2. Key Components & Design The "electronic" functionality of this part is passive, meaning it does not use electricity but is critical for the survival of active electronic circuits. * **Heat Sink Body:** Extruded aluminum optimizes the surface area-to-weight ratio. The **Blue Anodized** coating protects against corrosion and increases emissivity for better radiative cooling. * **Push-Pin Mounting:** This model uses a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force) between the heat sink and the electronic chip, which is vital for efficient heat transfer. * **Thermal Interface Material (TIM):** Typically, these come with pre-applied **T766** phase-change material or similar thermal grease on the base to fill microscopic air gaps between the component and the sink. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the specific electronic application: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **H1**: Series designation (often refers to specific fin geometry). 3. **95**: Specific size/design iteration. 4. **C2**: Color and Finish (C2 usually denotes Blue Anodized). 5. **R0**: Revision or packaging code. --- ### 4. Application in Electronics This part is used in environments where **forced air cooling** (fans) is present. Because of its 30mm height, it is ideal for: * **Industrial PCs:** Cooling processors in compact enclosures. * **Telecommunications:** Cooling ASICs in networking switches. * **Power Supplies:** Dissipating heat from MOSFETs or IGBTs.