The **ATS-55325D-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, specifically designed for cooling electronic components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 2.50° C/W (@ 200 LFM) | | **Dimensions (L x W x H)** | 32.20mm x 32.20mm x 9.50mm | | **Fin Style** | Tapered Fin (High Performance) | --- ## 2. Key Components & Technologies ### A. maxiFLOW™ Fin Design Unlike standard straight-fin heat sinks, this part uses a **tapered fin design**. This is engineered to maximize the surface area for heat dissipation while maintaining low pressure drop, allowing air to flow more efficiently across the electronic component. ### B. maxiGRIP™ Attachment System One of the most critical "parts" of this assembly is the attachment mechanism: * **Plastic Frame Clip:** A high-strength clip that surrounds the electronic component. * **Steady Spring:** A stainless steel "C-clip" that applies constant, uniform pressure across the heat sink to the component. * **Benefit:** This avoids the need to drill holes in the PCB, preventing electrical traces from being damaged. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the heat sink comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal pad. This material fills the microscopic gaps between the chip and the heat sink to ensure efficient heat transfer. --- ## 3. Application & Compatibility This part is typically used for cooling: 1. **Processors (CPUs/GPUs):** Small-scale embedded processors. 2. **FPGAs:** High-heat field-programmable gate arrays. 3. **ASICs:** Application-specific integrated circuits in networking hardware. --- ## 4. Performance at Airflow Heat dissipation effectiveness varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.50 | | 300 | 2.00 | | 400 | 1.80 | | 500 | 1.60 |