The **ATS-54375K-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Plastic frame clip) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 14.50mm | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Fin Style** | Tapered Fin Design | | **Thermal Interface Material** | Pre-applied phase-change material (T766) | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry The "maxiFLOW" design utilizes a unique tapered fin pattern. This geometry is engineered to: * Increase surface area for heat dissipation. * Minimize pressure drop across the heat sink. * Optimize airflow for high-density PCB layouts. #### B. maxiGRIP™ Attachment System The **-C2** in the part number refers to the attachment style. It uses a specialized plastic frame clip and a stainless steel spring clip. * **No Holes Required:** It attaches directly to the component/PCB without needing mounting holes. * **Constant Pressure:** Ensures consistent contact between the heat sink and the chip for optimal thermal transfer. * **Removability:** Allows the heat sink to be detached and reattached for rework or testing without damaging the board. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Applications This heat sink is commonly used in: * **Networking Gear:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules. ---