The **ATS-54230R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "maxiFLOW™" series, specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-54230R-C2-R0 | | **Dimensions (L x W x H)** | 54mm x 54mm x 23mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 0.94 °C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Geometry The "R" in the part number often refers to the specific fin pattern. This heat sink uses a flared fin design that maximizes surface area for convection cooling while minimizing pressure drop. This is crucial for electronic enclosures with limited airflow. #### B. maxiGRIP™ Attachment System This part uses a specialized mechanical attachment system: * **Frame Clip:** A plastic frame clips around the electronic component (like an FPGA or Processor). * **Steady Pressure:** A gold-colored "bi-directional" spring clip applies constant pressure, ensuring the thermal interface material (TIM) remains in contact with the die without over-stressing the solder joints. #### C. Thermal Interface Material (TIM) The **-C2** designation indicates that the unit typically comes pre-assembled with a high-performance thermal pad (specifically **Chomerics T766**), which facilitates the heat transfer from the chip to the aluminum fins. --- ### 3. Common Applications This heat sink is used for high-heat-generating electronic parts including: * **Network Switches & Routers:** Cooling ASICs. * **Industrial Computing:** Cooling high-speed processors. * **Power Supplies:** Heat dissipation for MOSFET arrays or large power transistors. --- ### 4. Comparison of Airflow Performance *Thermal resistance decreases as airflow (LFM - Linear Feet per Minute) increases:* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 0.94 | | 300 | 0.72 | | 400 | 0.61 | | 500 | 0.54 |