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  • ATS-52250P-C1-R0

  • AI
    The **ATS-52250P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for high-efficiency cooling of electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table outlines the core physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Dimensions** | 25.00mm x 25.00mm | | **Height** | 17.50mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.20°C/W @ 200 LFM | | **Attachment Method** | superGRIP (Clip-on) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Functions While the heat sink itself does not have electrical circuitry, it is critical for the reliable operation of electronic systems: * **Thermal Dissipation:** It increases the surface area of a semiconductor (like a CPU, FPGA, or GPU), allowing heat to be transferred more efficiently to the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied High-Performance Thermal Interface Material to ensure minimal air gaps between the chip and the aluminum. * **superGRIP™ Attachment:** This is a mechanical frame that clips onto the PCB. This is crucial because it provides high retention force without requiring holes in the PCB, protecting delicate electronic traces. --- ### 3. Common Applications The ATS-52250P-C1-R0 is generally found in compact electronic environments where heat density is high: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Systems:** Industrial controllers and IoT gateways. 3. **Video Processing:** Encoders and high-speed signal processing units. --- ### 4. Comparison with Standard Solutions | Aspect | Standard Adhesive Heat Sink | ATS superGRIP Series | | :--- | :--- | :--- | | **Mounting** | Thermal Tape/Epoxy | Mechanical Clip (superGRIP) | | **Reworkability** | Difficult/Permanent | Easy to remove and re-attach | | **Pressure** | Low/Inconsistent | High and Consistent | | **Vibration Resistance**| Moderate | High (Meets MIL-STD standards) |
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance at different airflow speeds (LFM) for this model?
    • ⤷ How does the superGRIP clip mechanism protect the PCB traces?
    • ⤷ Is this heat sink compatible with specific BGA package sizes?