ATS-52250P-C1-R0
AI

The **ATS-52250P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for high-efficiency cooling of electronic components like BGAs (Ball Grid Arrays).
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### 1. Technical Specifications
The following table outlines the core physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Dimensions** | 25.00mm x 25.00mm |
| **Height** | 17.50mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 5.20°C/W @ 200 LFM |
| **Attachment Method** | superGRIP (Clip-on) |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic Functions
While the heat sink itself does not have electrical circuitry, it is critical for the reliable operation of electronic systems:
* **Thermal Dissipation:** It increases the surface area of a semiconductor (like a CPU, FPGA, or GPU), allowing heat to be transferred more efficiently to the surrounding air.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied High-Performance Thermal Interface Material to ensure minimal air gaps between the chip and the aluminum.
* **superGRIP™ Attachment:** This is a mechanical frame that clips onto the PCB. This is crucial because it provides high retention force without requiring holes in the PCB, protecting delicate electronic traces.
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### 3. Common Applications
The ATS-52250P-C1-R0 is generally found in compact electronic environments where heat density is high:
1. **Telecommunications:** Network switches and routers.
2. **Embedded Systems:** Industrial controllers and IoT gateways.
3. **Video Processing:** Encoders and high-speed signal processing units.
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### 4. Comparison with Standard Solutions
| Aspect | Standard Adhesive Heat Sink | ATS superGRIP Series |
| :--- | :--- | :--- |
| **Mounting** | Thermal Tape/Epoxy | Mechanical Clip (superGRIP) |
| **Reworkability** | Difficult/Permanent | Easy to remove and re-attach |
| **Pressure** | Low/Inconsistent | High and Consistent |
| **Vibration Resistance**| Moderate | High (Meets MIL-STD standards) |
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What is the thermal resistance at different airflow speeds (LFM) for this model?
- ⤷ How does the superGRIP clip mechanism protect the PCB traces?
- ⤷ Is this heat sink compatible with specific BGA package sizes?