ATS-52170P-C1-R0
AI

The **ATS-52170P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Dimensions** | 17mm x 17mm x 17.5mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (with compression spring) |
| **Thermal Resistance** | 8.80° C/W @ 200 LFM |
| **Airflow Type** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (High performance) |
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### 2. Component Analysis
#### A. Design and Airflow
The part utilizes a **straight-fin design**. This geometry is optimized for systems with a specific direction of airflow. It provides a low pressure drop, allowing air to pass through the fins efficiently to carry away heat.
#### B. Attachment Mechanism (Push Pins)
Unlike adhesive-based heat sinks, the ATS-52170P-C1-R0 uses **push pins**.
* **Benefits:** Provides consistent mounting pressure on the chip, ensuring better thermal contact.
* **Requirement:** The Printed Circuit Board (PCB) must have pre-drilled holes to accommodate the pins.
#### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. This is a high-conductivity material that fills microscopic gaps between the heat sink base and the electronic component, significantly reducing thermal impedance.
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### 3. Common Applications
This heat sink is typically found in the following electronic environments:
1. **Networking Hardware:** Routers, switches, and modems.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Communication Devices:** Base stations and RF equipment.
4. **Integrated Circuits:** Cooling FBGA (Fine-pitch Ball Grid Array) packages.
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### 4. Part Number Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **52170:** Series and Dimension identifier.
* **P:** Push Pin attachment.
* **C1:** Material/Finish code (usually Blue Anodized).
* **R0:** Revision or Packaging variant.
- ⤷
What are the PCB hole diameter requirements for the ATS push pin system?
- ⤷ How does the thermal resistance of this part change under natural convection versus forced airflow?
- ⤷ Can the pre-applied T766 interface material be replaced with a thermal pad?