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  • ATS-52170P-C1-R0

  • AI
    The **ATS-52170P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Dimensions** | 17mm x 17mm x 17.5mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with compression spring) | | **Thermal Resistance** | 8.80° C/W @ 200 LFM | | **Airflow Type** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Component Analysis #### A. Design and Airflow The part utilizes a **straight-fin design**. This geometry is optimized for systems with a specific direction of airflow. It provides a low pressure drop, allowing air to pass through the fins efficiently to carry away heat. #### B. Attachment Mechanism (Push Pins) Unlike adhesive-based heat sinks, the ATS-52170P-C1-R0 uses **push pins**. * **Benefits:** Provides consistent mounting pressure on the chip, ensuring better thermal contact. * **Requirement:** The Printed Circuit Board (PCB) must have pre-drilled holes to accommodate the pins. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-conductivity material that fills microscopic gaps between the heat sink base and the electronic component, significantly reducing thermal impedance. --- ### 3. Common Applications This heat sink is typically found in the following electronic environments: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Communication Devices:** Base stations and RF equipment. 4. **Integrated Circuits:** Cooling FBGA (Fine-pitch Ball Grid Array) packages. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **52170:** Series and Dimension identifier. * **P:** Push Pin attachment. * **C1:** Material/Finish code (usually Blue Anodized). * **R0:** Revision or Packaging variant.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS push pin system?
    • ⤷ How does the thermal resistance of this part change under natural convection versus forced airflow?
    • ⤷ Can the pre-applied T766 interface material be replaced with a thermal pad?