The **ATS-21B-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the primary physical and thermal characteristics of this specific part number: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Thermal Resistance** | 10.70°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. The Fin Profile (Straight Fin) The **159** designation in the part number indicates the specific fin pattern. This model uses a **Straight Fin** design. * **Function:** Straight fins allow for consistent airflow in a single direction. * **Efficiency:** It is optimized for systems with a defined "airflow path" (e.g., server racks or desktop cases with intake/exhaust fans). #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "B" in the part number signifies a push-pin attachment. * **Mechanism:** A spring-loaded brass pin is inserted through pre-drilled holes in the PCB. * **Benefit:** This provides consistent pressure (load) on the electronic chip, ensuring maximum contact with the thermal interface material and preventing the heat sink from shifting due to vibration. #### C. Thermal Interface Material (TIM) The part comes pre-installed with **T766** phase-change material. * This eliminates the need for manual application of thermal paste. * The **C2** in the code refers to the specific "Performance" grade of the thermal interface and the aluminum alloy used. --- ### 3. Application Use Cases This specific low-profile (10mm) heat sink is commonly used in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** For industrial PCs where vertical space is limited. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators. --- ### 4. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **21** | Series/Category (pushPIN™) | | **B** | Attachment style (Push-pin with springs) | | **159** | Specific dimension and fin configuration | | **C2** | Thermal performance/Material grade | | **R0** | Revision/Packaging code |