ATS-20A-159-C2-R0
AI

The **ATS-20A-159-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin style heat sink** designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. It is manufactured by Advanced Thermal Solutions (ATS).
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### 1. Technical Specifications
The part is defined by its physical dimensions and thermal properties. Below are the key specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | ~1.00°C/W (varies with airflow) |
| **Pattern** | Fine Pitch (straight fin) |
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### 2. Physical Design Components
This assembly consists of three main electronic/mechanical sub-parts:
1. **Heat Sink Body:** A block of aluminum with extruded fins. Aluminum is chosen for its high thermal conductivity and lightweight properties.
2. **Push-Pins:** These are the mechanical fasteners that secure the heat sink to the Printed Circuit Board (PCB). They are designed for standardized 3.0mm holes.
3. **Springs:** High-tension compression springs ensure constant, uniform pressure between the heat sink and the electronic component to maximize heat transfer.
4. **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or a similar thermal pad on the base to fill microscopic air gaps between the chip and the metal.
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### 3. Thermal Performance Analysis
The efficiency of the ATS-20A-159-C2-R0 depends heavily on the velocity of the air (measured in Linear Feet per Minute - LFM) passing through the fins.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 LFM** | 3.82 |
| **400 LFM** | 2.15 |
| **600 LFM** | 1.62 |
| **800 LFM** | 1.34 |
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### 4. Part Number Breakdown
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS:** Manufacturer prefix.
* **20A:** Series designation (height/fin style).
* **159:** Unique footprint code (45x45mm).
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision/Packaging indicator.
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What are the PCB hole requirements for mounting this specific heat sink?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied TIM?