The part number **ATS-19F-159-C1-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. This specific model belongs to the **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 10mm (Low Profile) | | **Thermal Resistance** | 10.68°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine Pitch (XC-Cut) | --- ### 2. Breakdown of the Part Number The part number is structured to define every physical attribute of the heatsink: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **19**: Series identifier (pushPIN™ Heatsink). * **F**: Attachment Type (in this case, for a specific hole pattern/spring). * **159**: Unique geometry/fin configuration code. * **C1**: Material and Finish code (C1 typically denotes Blue Anodized Aluminum). * **R0**: Revision or Packaging status. --- ### 3. Key Electronic Cooling Features #### **A. Thermal Interface Material (TIM)** This part usually comes pre-applied with **T766** or similar thermal grease. This ensures there are no air gaps between the electronic chip and the aluminum base, maximizing heat transfer. #### **B. Attachment Mechanism** Instead of using messy adhesives or permanent solder, this part uses the **pushPIN™** system: * **Brass Components:** The pins are made of durable brass. * **Compression Springs:** These provide precise "Firm-Grip" pressure, ensuring the heatsink stays in contact with the chip during vibrations or thermal expansion. #### **C. XC-Cut Fin Design** The "XC-Cut" refers to a cross-cut fin pattern. Unlike straight fins, cross-cut fins allow for **multi-directional airflow**. This is critical in crowded PCB environments where air might not be blowing in a single straight line. --- ### 4. Typical Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Networking:** Heat dissipation for high-speed switch chips. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).