The **ATS-19D-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "Blue Anodized" series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19D-159-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.09°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight (Fine Pitch) | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Component Breakdown #### 1. Heat Sink Body (The Core) The part is made from **Aluminum 6063**, which is the industry standard for thermal conductivity and weight. The 45mm x 45mm footprint makes it suitable for mid-sized Integrated Circuits (ICs). The 10mm height provides a low-profile solution for space-constrained enclosures. #### 2. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex brackets, this part uses **Plastic Push-Pins**. * **Compression Spring:** Each pin includes a high-tension spring that ensures even pressure across the chip surface. * **Stability:** This mechanical attachment provides a more secure mount than "peel-and-stick" tapes, especially in high-vibration environments. #### 3. Thermal Interface Material (TIM) The **C2** in the part number indicates the specific TIM used: **T766**. * This is a phase-change or high-performance thermal pad pre-applied to the base. * It fills microscopic air gaps between the chip and the aluminum to maximize heat transfer. #### 4. Surface Finish (Blue Anodized) The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Emissivity:** Slightly improves the heat radiation properties of the surface. --- ### Usage Context This part is typically found in: * **Networking Hardware:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.