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  • ATS-18B-75-C3-R0

  • AI
    The **ATS-18B-75-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*, designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.33°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | --- ### Key Electronic Components & Features The "ATS-18B-75-C3-R0" is not a powered device itself, but an essential mechanical-electronic interface part. Its design includes several critical sub-components: #### 1. Heat Sink Body (Aluminum) The body is designed with a **fine-pitch fin structure**. This maximizes the surface area to allow heat to transfer from the electronic component (like a CPU, GPU, or FPGA) into the surrounding air. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a **Push Pin mechanism**. * **Springs:** Provide consistent pressure (Force) to ensure the heat sink remains in perfect contact with the electronic chip. * **Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies that a **Thermal Interface Material** (like a pre-applied thermal pad or phase-change material) is included. This fills the microscopic air gaps between the chip and the heat sink to improve heat conduction. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, slightly enhancing radiant heat transfer. --- ### Applications in Electronics This specific heat sink is commonly used for: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** High-heat environments where active fans might fail. * **Power Supplies:** Cooling MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the different types of Push Pin materials available for this heat sink?
    • ⤷ How does the 'C3' designation in the part number affect the thermal performance?
    • ⤷ Can this heat sink be used with a cooling fan for active thermal management?