The **ATS-18B-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed for cooling high-power semiconductors and ICs. ### 1. Technical Specifications The following table summarizes the core electronic and mechanical parameters of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 5.11° C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Orientation** | High-performance pin fin pattern | --- ### 2. Key Components & Construction #### A. Thermal Interface Material (TIM) * **Part Suffix (-C2):** The "C2" indicates that the heat sink comes pre-applied with **T766 phase change material**. This acts as the thermal bridge between the electronic component (CPU/FPGA/GPU) and the aluminum base, ensuring minimal air gaps and maximum heat transfer. #### B. The pushPIN™ Attachment System * **Mechanical Stability:** The "R0" suffix refers to the specific attachment kit. It uses a spring-loaded push-pin mechanism. * **PCB Integration:** This requires pre-drilled holes in the Printed Circuit Board (PCB). The pins provide a precise amount of downward pressure (clamping force) to optimize thermal contact without damaging the electronic component or the PCB traces. #### C. Fin Geometry (maxiFLOW™) * The spread-fin design is specifically engineered to handle **non-uniform airflow**. In complex electronic enclosures where fans might be obstructed, the "flared" fins maximize the surface area exposed to air, reducing the junction temperature of the semiconductor. --- ### 3. Application Use Cases This part is typically used to cool sensitive electronic devices that generate significant heat during operation, including: * **FPGAs & ASICs:** High-speed logic gates in networking equipment. * **Power Transistors:** Components in power supply units (PSUs). * **Embedded Systems:** Industrial PCs and automation controllers. --- ### 4. Thermal Performance Data Thermal resistance determines how many degrees the component temperature will rise for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.70 | | 200 (1.0 m/s) | 5.11 | | 400 (2.0 m/s) | 3.10 | | 600 (3.0 m/s) | 2.45 |