## Electronic Specifications: ATS-18A-40-C2-R0 The **ATS-18A-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 1.45 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 48.26mm x 48.26mm x 15mm | | **Pressure Drop** | 0.15 in. H2O (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design & Cooling Mechanism The part is engineered for **forced convection** cooling environments. Its unique design features include: * **Tapered Fin Design:** The fins are flared outwards to increase the surface area and improve airflow through the heat sink, reducing the "bypass" air that usually flows around a square heat sink. * **pushPIN™ Attachment:** This is a mechanical attachment system that uses a spring-loaded pin. It provides a specific, consistent pressure (preload) against the electronic chip, which is critical for maximizing the effectiveness of the thermal interface material. * **Low Profile:** With a height of 15mm, it is suitable for 1U server chassis or compact electronic enclosures where vertical space is limited. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.45 | | **300 (1.5 m/s)** | 1.22 | | **400 (2.0 m/s)** | 1.05 | | **500 (2.5 m/s)** | 0.95 | --- ### 4. Component Compatibility This heat sink is typically used for large-scale integrated circuits. The **C2** in the part number indicates a specific type of thermal interface material (T766), which is a high-performance phase-change material that melts during operation to fill microscopic air gaps between the chip and the heat sink.