The part number **ATS-18A-08-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components such as BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table breaks down the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin (with springs) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (Fin Depth)** | 15.00mm | | **Fin Style** | Straight (Square) | | **Fin Pattern** | Fine Pitch | | **Thermal Resistance** | 14.61°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number Electronic hardware often follows a specific nomenclature. Here is how the part number is structured: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18A**: The specific model/series design. * **08**: Dimension or internal design code. * **C2**: Material and Finish (typically refers to **Blue Anodized** finish). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical component, its role in an electronic circuit is critical for performance: 1. **Thermal Dissipation**: It increases the surface area of a high-heat component (like a CPU, FPGA, or GPU), allowing heat to transfer into the ambient air via convection. 2. **Thermal Interface Material (TIM)**: These units typically come with a pre-applied thermal interface (like **T766**) to fill microscopic air gaps between the chip and the metal. 3. **Mechanical Attachment**: The "push-pin" design uses a brass or plastic pin with a compressed spring to ensure constant downward pressure, maintaining a secure thermal contact even during vibration. --- ### 4. Application Use-Case This specific size (45mm x 45mm) is standard for: * **Telecommunications equipment** (Routers, Switches). * **Power Supplies** where high-density components generate significant heat. * **Embedded Computing** boards where passive cooling is preferred over active fans.