The **ATS-17F-142-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin style heatsink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, to ensure operational stability. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Heatsink Shape** | Square, Fine Pitch Fins | | **Attachment Type** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features #### A. The Heatsink Body * **Material:** Made from high-grade aluminum for high thermal conductivity. * **Fin Design:** It features a "Cross-Cut" or "Straight Fin" design (depending on specific batch airflow tuning) that maximizes surface area for heat transfer to the surrounding air. * **Anodization:** The blue anodized coating provides a layer of protection against corrosion and minor electrical insulation, though its primary function is to increase emissivity. #### B. Mounting Mechanism (Push-Pins) * **Hardware:** Uses two plastic push-pins and a compressed spring. * **Function:** This ensures a consistent, high-pressure contact between the heatsink base and the electronic chip, which is critical for reducing thermal resistance at the interface. #### C. Thermal Interface Material (TIM) * **Phase Change Material:** The unit comes with **T766** pre-applied. This is a "dry" thermal pad that softens or melts when the electronic component reaches operating temperature, filling microscopic air gaps between the chip and the metal. --- ### 3. Usage Environment This part is typically found in: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. ---