ATS-15A-159-C2-R0
AI

The **ATS-15A-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-power semiconductor cooling.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Thermal Resistance** | 2.10°C/W (at 200 LFM) |
| **Weight** | ~40 grams |
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### 2. Key Electronic Features
#### A. pushPIN™ Attachment System
This heat sink utilizes the ATS proprietary **pushPIN™** system. It consists of a pre-assembled spring and pin mechanism.
- **Benefits:** Ensures consistent pressure (clamping force) on the electronic component, which optimizes the thermal interface material (TIM) performance and prevents damage during assembly.
#### B. Thermal Performance
The "C2" in the part number indicates a specific thermal configuration. The fin design is optimized for **forced air cooling** (convection).
- **Flow Pattern:** Designed for straight-line airflow.
- **Material Efficiency:** The aluminum construction provides high thermal conductivity while remaining lightweight for PCB surface mounting.
#### C. Pre-applied Thermal Interface (TIM)
The "R0" suffix typically denotes that the product comes with a high-performance **T766 phase-change material** or equivalent thermal pad pre-applied to the base, ensuring immediate "out-of-the-box" installation with minimal thermal resistance between the chip and the sink.
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### 3. Application Use-Cases
* **CPUs and GPUs:** Cooling of mid-range processors.
* **FPGAs/ASICs:** Heat dissipation for high-speed logic gates and networking chips.
* **Power Electronics:** Used in DC-DC converters and motor drivers where localized heat generation is high.
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- ⤷
How does the pushPIN™ attachment compare to traditional adhesive cooling?
- ⤷ What is the recommended airflow speed (LFM) for maximum efficiency with this heat sink?
- ⤷ Are there specific PCB hole patterns required for the ATS-15A-159-C2-R0?