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  • ATS-15A-159-C2-R0

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    The **ATS-15A-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-power semiconductor cooling. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 2.10°C/W (at 200 LFM) | | **Weight** | ~40 grams | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System This heat sink utilizes the ATS proprietary **pushPIN™** system. It consists of a pre-assembled spring and pin mechanism. - **Benefits:** Ensures consistent pressure (clamping force) on the electronic component, which optimizes the thermal interface material (TIM) performance and prevents damage during assembly. #### B. Thermal Performance The "C2" in the part number indicates a specific thermal configuration. The fin design is optimized for **forced air cooling** (convection). - **Flow Pattern:** Designed for straight-line airflow. - **Material Efficiency:** The aluminum construction provides high thermal conductivity while remaining lightweight for PCB surface mounting. #### C. Pre-applied Thermal Interface (TIM) The "R0" suffix typically denotes that the product comes with a high-performance **T766 phase-change material** or equivalent thermal pad pre-applied to the base, ensuring immediate "out-of-the-box" installation with minimal thermal resistance between the chip and the sink. --- ### 3. Application Use-Cases * **CPUs and GPUs:** Cooling of mid-range processors. * **FPGAs/ASICs:** Heat dissipation for high-speed logic gates and networking chips. * **Power Electronics:** Used in DC-DC converters and motor drivers where localized heat generation is high. ---
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to traditional adhesive cooling?
    • ⤷ What is the recommended airflow speed (LFM) for maximum efficiency with this heat sink?
    • ⤷ Are there specific PCB hole patterns required for the ATS-15A-159-C2-R0?