The **ATS-13F-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the product. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Plastic or Brass) | | **Thermal Resistance** | ~20.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ### 2. Key Components & Design Features #### A. Fin Design * **Profile:** This model uses a **XCUT** (Cross-Cut) or straight fin design. * **Efficiency:** The fin pattern is optimized for air circulation from multiple directions, making it ideal for systems where airflow direction might vary. #### B. Attachment Mechanism (pushPIN™) * **Push-pins:** It uses a spring-loaded push-pin system. This ensures even pressure across the surface of the component (e.g., a BGA chip), which optimizes heat transfer. * **Springs:** High-tension springs provide consistent "Normal Force" to keep the heat sink flush against the chip. #### C. Thermal Interface Material (TIM) * The **"R0"** suffix typically indicates that the part comes pre-applied with a high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal paste and ensures low thermal resistance between the chip and the sink. --- ### 3. Usage Context This specific heat sink is categorized as a "Low Profile" solution (only 10mm high). It is best suited for: 1. **Compact Electronics:** 1U servers, small form factor (SFF) PCs, or embedded systems. 2. **High-Density Boards:** Where vertical space is restricted by neighboring components or enclosures. 3. **Active/Passive Cooling:** While it can work passively, its performance scales significantly with active airflow (fans). --- ### 4. Part Number Breakdown To understand the "Electronic DNA" of the part: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13:** Series number. * **F:** Attachment type (Push-Pin). * **97:** Size and Fin configuration code. * **C2:** Material/Finish (typically Aluminum with Blue Anodization). * **R0:** Packaging and Thermal Interface Material status.