The **ATS-13F-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This component is part of the "pushPIN™" series, designed for efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | XCUT (Cross-cut) | | **Thermal Resistance** | 3.93°C/W (at 100 LFM) | | **Dimensions** | 35mm x 35mm x 10mm | | **Finish** | Blue Anodized | --- ## 2. Key Component Breakdown ### A. The Heat Sink Body The body is made of lightweight aluminum, which provides excellent thermal conductivity. The **XCUT** fin pattern allows for multi-directional airflow, making it ideal for systems where the direction of the cooling fan may vary or be inconsistent. ### B. The pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical fastening system: * **Pins:** Usually made of plastic or brass to secure the sink to the PCB. * **Springs:** Provides consistent pressure (Pre-assembled) to ensure maximum contact between the chip and the heat sink. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material applied to the base. This ensures that microscopic air gaps between the heat sink and the electronic component are filled, significantly reducing thermal resistance. --- ## 3. Part Number Decoder (Nomenclature) Understanding the name helps in identifying the specific configuration: * **ATS:** Advanced Thermal Solutions (Brand) * **13:** Series number * **F:** Fin profile/attachment type * **151:** Dimensional code (35x35mm) * **C2:** Thermal Interface Material (T766 phase change material) * **R0:** Revision/Standard packaging --- ## 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Consumer Electronics:** High-speed processing units that require a low-profile cooling solution (10mm height).