The **ATS-13D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Type** | Push-Pin (Brass or Plastic) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Off Base)** | 10mm | | **Fin Style** | Fine-Pitch (increases surface area) | | **Thermal Resistance** | ~10.66°C/W (at 100 LFM) to ~2.10°C/W (at 700 LFM) | --- ### 2. Key Components and Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "13D" series uses a mechanical **push-pin and spring** mechanism. This ensures: * **Constant Pressure:** The spring provides consistent downward force for optimal thermal interface material (TIM) contact. * **Reliability:** It is more secure than thermal tape in high-vibration environments. * **Pre-Drilled Holes:** Requires specific hole patterns on the PCB for mounting. #### B. Thermal Interface Material (TIM) The part comes pre-applied with a high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the heat source (the chip) and the aluminum base of the heat sink to maximize heat transfer. #### C. Fin Geometry The "C1" designation typically refers to a specific fin density. This model uses a **Fine-Pitch** fin design, which provides a high surface-area-to-volume ratio, making it highly effective in systems with forced air cooling (fans). --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS-13D** | Series (pushPIN™ High Performance) | | **159** | Specific thermal/physical footprint model | | **C1** | Material/Thermal configuration (High density) | | **R0** | RoHS Compliant and specific revision | --- ### 4. Application Use Cases * **Embedded Systems:** Industrial PCs where space is tight but heat generation is high. * **Networking Hardware:** Routers and switches that require reliable 24/7 cooling. * **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs).