The **ATS-13B-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the Advanced Thermal Solutions (ATS) **maxiFLOW™** series. It is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, and FPGAs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13B-101-C2-R0 | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) to 1.15°C/W (at 800 LFM) | | **Fin Pattern** | Straight / maxiFLOW™ | --- ### Core Components & Engineering Features #### 1. The maxiFLOW™ Fin Geometry The "B" in the series designates a specific fin profile. These heat sinks feature a unique spread-fin design that increases the surface area while maintaining a low pressure drop. This allows for maximum heat transfer into the surrounding airflow, even in constrained environments. #### 2. Material and Finish * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodized Coating:** This is not just aesthetic; anodizing protects the aluminum from corrosion and slightly increases the surface emissivity, aiding in radiation heat transfer. #### 3. The pushPIN™ Attachment System The "C2" in the part number refers to the mounting hardware. * **Spring-loaded Pins:** These ensure a consistent and precise pressure (preload) between the heat sink and the electronic component. * **Thermal Interface Material (TIM):** This model typically comes with a pre-applied high-performance thermal phase-change material or grease to bridge the microscopic air gaps between the component and the sink. #### 4. Thermal Performance Metrics The effectiveness of this part is measured by its thermal resistance (expressed in °C/W). As airflow increases (measured in Linear Feet per Minute - LFM), the resistance drops: * **Low Airflow (1.0 m/s):** High resistance (~6.69°C/W). * **High Airflow (4.0 m/s):** Very low resistance (~1.15°C/W). --- ### Application Use Cases * **Telecom & Networking:** Cooling high-speed processors in switches and routers. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.