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  • ATS-12F-99-C2-R0

  • AI
    The **ATS-12F-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.52°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | --- ### 2. Physical Design Features * **Fin Style:** This model typically utilizes a **Straight Fin** or **Cross-Cut** pattern. The 20mm height provides a significant surface area for air-to-metal contact. * **Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes pre-applied with a high-performance thermal interface material (usually T766), ensuring low thermal resistance between the chip and the heat sink. * **Attachment Mechanism:** The "Push-Pin" system uses a spring-loaded mechanism. This ensures constant pressure (load) on the component, which improves heat transfer and prevents the sink from shifting during vibration. --- ### 3. Application Use Cases This specific heat sink is often found in industrial and computing environments: 1. **Telecommunications:** Cooling of networking ASICs and FPGAs. 2. **Power Supplies:** Heat dissipation for MOSFETs and power modules. 3. **Embedded Systems:** Cooling small form-factor industrial PCs. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-12F-99-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.52 | | 300 (1.5 m/s) | 4.03 | | 500 (2.5 m/s) | 2.50 | | 700 (3.5 m/s) | 1.83 | ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for mounting this heat sink?
    • ⤷ Are there alternative push-pin materials available for high-vibration environments?
    • ⤷ How does 'Blue Anodized' finish affect the thermal emissivity of the part?