The **ATS-11H-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, and power modules. ### 1. Technical Specifications Below is a detailed breakdown of the physical and thermal properties of this specific part: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-11H-159-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.09°C/W @ 200 LFM | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures even pressure across the component. This prevents mechanical stress on the PCB while maintaining consistent contact with the heat source. * **Aluminum Construction:** Aluminum is used for its high thermal conductivity and lightweight properties. The blue anodized finish provides corrosion resistance and increased emissivity. * **Fine-Pitch Fins:** The "159" series features a specific fin density designed to maximize surface area for heat dissipation, making it effective in systems with forced-air cooling (fans). * **Pre-Applied TIM:** The unit comes with **T766 thermal interface material**, which simplifies the assembly process by eliminating the need for manual thermal paste application. --- ### 3. Thermal Performance (Deg C/W) Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM | 3.28 | | 200 LFM | 2.09 | | 300 LFM | 1.77 | | 400 LFM | 1.58 | --- ### 4. Application Use Cases This heat sink is typically used in: * **Telecommunications:** Cooling of high-speed networking processors. * **Industrial PCs:** Thermal regulation for embedded systems. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.