The **ATS-10F-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The model number provides specific information regarding its dimensions and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | Variable (Dependent on Airflow) | --- ### 2. Key Design Components #### A. Pin Fin Geometry Unlike traditional straight-fin heat sinks, this model uses a **cross-cut pin fin** design. This provides a larger surface area and allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of the direction the cooling fan is blowing. #### B. Push-Pin Attachment The "75" in the part number corresponds to the specific hole pattern/spacing for mounting. * **Mechanical Stability:** Uses a spring-loaded push-pin mechanism. * **Uniform Pressure:** Ensures a consistent interface between the heat sink base and the electronic component (TIM - Thermal Interface Material). #### C. Thermal Interface Material (TIM) The "C3" designation typically indicates that the part comes pre-applied with a high-performance thermal grease or pad. This fills microscopic air gaps between the heat sink and the chip to maximize heat transfer. --- ### 3. Electronic Application Use-Cases This specific heat sink is categorized as a "High Performance" cooling solution, typically found in: * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Telecommunications:** Cooling of ASICs and FPGAs in networking switches. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. --- ### 4. Thermal Performance Data Performance is measured by **Thermal Resistance (°C/W)**. Lower numbers indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | ~5.30 | | **Ducted (Forced @ 200 LFM)** | ~1.60 | | **Ducted (Forced @ 500 LFM)** | ~0.95 |