The **ATS-08F-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" series, designed for optimized airflow and heat dissipation in confined spaces. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-08F-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 40mm x 15mm | | **Fin Style** | Straight | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Pressure Drop** | 0.40 inH2O (at 100 LFM) | --- ### Key Components and Features #### 1. pushPIN™ Attachment System The part utilizes the **pushPIN™** system, which is a standardized mounting mechanism. * **Spring-loaded:** It uses a brass or plastic pin with a stainless steel spring to provide consistent pressure. * **Reliability:** Ensures the heat sink remains in firm contact with the electronic component (CPU, GPU, or ASIC) to maximize thermal transfer. * **Hardware:** Includes pre-drilled holes to match specific PCB layouts. #### 2. maxiFLOW™ Fin Geometry The fins are designed with a specific "tapered" profile: * **Surface Area:** The design maximizes the surface area available for convection. * **Airflow Efficiency:** It reduces "pressure drop," meaning air can flow through the fins more easily even when using smaller, low-power fans. #### 3. Thermal Interface Material (TIM) * The part usually comes with a pre-applied **Thermal Phase Change Material** or high-performance thermal grease on the base. This fills microscopic air gaps between the heat sink and the electronic chip. #### 4. Blue Anodized Coating * **Protection:** Prevents corrosion and oxidation of the aluminum. * **Emissivity:** The dark anodized layer slightly improves the radiative heat transfer properties compared to raw aluminum. --- ### Application Use Cases This specific heat sink is typically used for cooling: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGA/ASIC** chips in networking equipment. * **Power Modules** in industrial power supplies. ---