The **ATS-08F-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | Push-pin Heat Sink | | **Fin Style** | Square Fin (Cross-cut) | | **Base Dimensions** | 40.00 mm x 40.00 mm | | **Height** | 20.00 mm | | **Thermal Resistance** | 12.32 °C/W (Unducted @ 100 LFM) | | **Mounting Hardware** | ATS-PP-06 | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features * **Thermal Performance:** The square-fin (cross-cut) design provides a high surface area to volume ratio, which is ideal for multi-directional airflow. * **Push-Pin Mounting:** It utilizes a specialized spring-loaded push-pin mechanism. This ensures constant pressure against the electronic component for optimal heat transfer without over-tightening. * **Pre-Applied TIM:** The unit comes with **T766 thermal interface material**, which eliminates the need for manual application of thermal paste during assembly. * **Material Selection:** Built from AL6063 aluminum, providing a good balance between thermal conductivity, weight, and corrosion resistance. --- ### 3. Part Number Breakdown (Deciphering the Code) The part number follows a specific nomenclature used by ATS: | Code | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Series Identifier (Push-Pin Heat Sink) | | **F** | Fin Pitch / Density | | **63** | Specific Model / Dimension ID | | **C2** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant / Revision Number | --- ### 4. Typical Applications This part is commonly used in industrial and consumer electronics where space is limited but thermal loads are significant: * Embedded systems and Single Board Computers (SBCs). * Networking hardware (switches, routers). * Field Programmable Gate Arrays (FPGAs). * Power conversion modules.