The **ATS-08F-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push-pin" attachment series. ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 14.56°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 14.50mm | | **Weight** | 10.51 grams | --- ### 2. Design Characteristics This heatsink is engineered for specific airflow conditions and mechanical reliability: * **Fine Pitch Fin Design:** The "F" in the part number indicates a fine-pitch fin pattern, which provides a larger surface area for heat dissipation in environments with higher airflow speeds. * **Push-Pin Mounting:** Unlike adhesive-based heatsinks, this uses a mechanical push-pin system. This ensures consistent pressure (clamping force) on the chip, which improves thermal transfer and prevents the heatsink from shifting due to vibration. * **High-Performance TIM:** It typically comes with **Pre-applied Thermal Interface Material (TIM)**, usually the T766 phase-change material, which ensures low thermal resistance between the component and the heatsink base. ### 3. Application Use Cases This specific part is commonly found in: 1. **Telecommunications:** Cooling networking switches and routers. 2. **High-Speed Computing:** Managing heat for CPUs, GPUs, or FPGAs. 3. **Industrial Controls:** Cooling power modules in automated systems where vibration resistance is required. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as the airflow (Measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.56 | 4.93 | 2.50 | ---