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  • ATS-08F-182-C2-R0

  • AI
    The **ATS-08F-182-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the *pushPIN™* series. --- ### 1. Technical Specifications This part is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push Pin (with spring) | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Design Features The "F" in the part number indicates a **Fine Pitch** fin design, which provides a larger surface area for heat exchange compared to standard sinks. * **Fin Style:** Straight fin configuration for optimized airflow. * **Mounting System:** Uses a brass push-pin and a stainless steel spring to provide consistent pressure (7.5 - 10 lbs) against the heat source, ensuring optimal thermal contact. * **Base:** Flat bottom with pre-applied phase-change Thermal Interface Material (TIM) to eliminate air gaps between the chip and the metal. --- ### 3. Thermal Performance Analysis Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.51 | | 300 (1.5 m/s) | 3.55 | | 500 (2.5 m/s) | 2.67 | | 700 (3.5 m/s) | 2.23 | --- ### 4. Part Number Breakdown (Nomenclature) * **ATS**: Advanced Thermal Solutions. * **08**: Series/Product family. * **F**: Fin pitch (Fine). * **182**: Specific dimensions and fin height profile. * **C2**: Color/Finish (Blue Anodized). * **R0**: Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a 'Fine Pitch' fin design over a 'Coarse Pitch' design?
    • ⤷ How do I determine if 7.51°C/W thermal resistance is sufficient for my specific processor?
    • ⤷ Can the push-pin mounting system be used on standard PCB hole patterns?