ATS-08F-182-C2-R0
AI

The **ATS-08F-182-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the *pushPIN™* series.
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### 1. Technical Specifications
This part is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push Pin (with spring) |
| **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Physical Design Features
The "F" in the part number indicates a **Fine Pitch** fin design, which provides a larger surface area for heat exchange compared to standard sinks.
* **Fin Style:** Straight fin configuration for optimized airflow.
* **Mounting System:** Uses a brass push-pin and a stainless steel spring to provide consistent pressure (7.5 - 10 lbs) against the heat source, ensuring optimal thermal contact.
* **Base:** Flat bottom with pre-applied phase-change Thermal Interface Material (TIM) to eliminate air gaps between the chip and the metal.
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### 3. Thermal Performance Analysis
Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 7.51 |
| 300 (1.5 m/s) | 3.55 |
| 500 (2.5 m/s) | 2.67 |
| 700 (3.5 m/s) | 2.23 |
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### 4. Part Number Breakdown (Nomenclature)
* **ATS**: Advanced Thermal Solutions.
* **08**: Series/Product family.
* **F**: Fin pitch (Fine).
* **182**: Specific dimensions and fin height profile.
* **C2**: Color/Finish (Blue Anodized).
* **R0**: Revision/Packaging code.
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What are the benefits of using a 'Fine Pitch' fin design over a 'Coarse Pitch' design?
- ⤷ How do I determine if 7.51°C/W thermal resistance is sufficient for my specific processor?
- ⤷ Can the push-pin mounting system be used on standard PCB hole patterns?