The **ATS-08D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Fin Style** | XC-Cut (Cross-cut / Pin Fin) | | **Thermal Resistance** | 10.68°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Component Features #### A. XC-Cut Fin Design Unlike straight-fin heat sinks, the XC-Cut (cross-cut) pattern creates a "pin-fin" effect. This design is highly efficient because: * It allows for **omni-directional airflow**, meaning air can enter the fins from any direction. * It breaks up the boundary layer of air, increasing turbulence and enhancing heat transfer. #### B. pushPIN™ Attachment System The "R0" at the end of the part number indicates the use of the ATS pushPIN™ system. * **Ease of Assembly:** Features a flexible, pre-assembled spring-loaded pin. * **Constant Pressure:** Ensures uniform pressure across the thermal interface material (TIM) for maximum heat transfer. * **Compatibility:** Designed for PCB holes spaced at specific intervals (standard 38mm x 38mm pitch for this model). #### C. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied. This is a high-performance thermal phase-change material or grease that fills microscopic air gaps between the component and the heat sink base. --- ### 3. Applications This part is commonly used in space-constrained electronic environments: * **Telecommunications:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules that require low-profile cooling. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as the velocity of air (measured in Linear Feet per Minute - LFM) increases: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.68 | | 300 (1.5 m/s) | 4.47 | | 500 (2.5 m/s) | 3.23 | | 700 (3.5 m/s) | 2.65 |