The **ATS-08B-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.69°C/W @ 100 LFM (Low Airflow) | | **Fin Style** | Straight Fin (Extrusion) | --- ### 2. Core Electronic/Thermal Components The "part" itself is a passive cooling assembly consisting of three main electronic hardware elements: #### A. The Heat Sink Body * **Design:** It uses a cross-cut pattern or straight fins to increase surface area. This allows heat generated by the Integrated Circuit (IC) to dissipate into the surrounding air. * **Material:** Made from Aluminum 6063, which offers high thermal conductivity while remaining lightweight. #### B. The Push-Pin Attachment * **Mechanism:** It features a spring-loaded push-pin mechanism. This provides a precise "preload" or downward force on the chip. * **Benefit:** This ensures consistent contact between the heat sink and the electronic component, which is critical for preventing hot spots. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific part number typically comes with **T766** thermal phase-change material or a similar pad pre-applied to the base. * **Function:** It fills microscopic air gaps between the CPU/GPU and the heat sink base to maximize heat transfer efficiency. --- ### 3. Part Number Decoder Understanding the nomenclature helps in identifying its application: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **08** | Series or internal designation | | **B** | Standard Material (Aluminum) | | **101** | Dimensions/Configuration code | | **C2** | Thermal Performance Grade / Coating (Blue Anodized) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Implementation Example In a typical PCB design, this part is used to cool high-heat components like FPGAs, ASICs, or Northbridge chipsets. ```c // Design Constraint Example Target_Component_TDP = 15W; Ambient_Temp = 40C; Max_Junction_Temp = 90C; Required_Thermal_Resistance = (90 - 40) / 15 = 3.33 C/W; // ATS-08B-101-C2-R0 provides ~1.20 C/W at high airflow (700 LFM), // making it suitable for high-performance cooling. ```