The **ATS-07H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature that describes its physical build: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Specific series or family within the pushPIN catalog. * **H**: High-performance fin profile. * **101**: Dimensional code (Length/Width/Height configuration). * **C2**: Finish code (typically refers to Blue Anodized). * **R0**: RoHS compliance status and revision level. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it contains no circuitry), it is critical for the survival of active electronic components: * **Heat Dissipation:** It increases the surface area of the heat source, allowing ambient air to carry away thermal energy more efficiently. * **Thermal Interface (TIM):** This part comes with **T766** pre-applied. This is a thermally conductive paste that fills microscopic air gaps between the chip and the aluminum base to maximize heat transfer. * **Mechanical Security:** The "Push-Pin" mechanism ensures a consistent downward pressure (clamping force) against the chip, which is vital for maintaining thermal contact without cracking the silicon die. --- ### 4. Common Applications * **Embedded Systems:** Industrial PCs where space is tight but vertical height (30mm) is available. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Networking Gear:** Cooling ASICs in switches and routers.