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  • ATS-07G-101-C2-R0

  • AI
    The **ATS-07G-101-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Off Base)** | 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | --- ### 2. Key Features and Components #### A. The pushPIN™ Attachment System This part utilizes a specialized mounting mechanism called **pushPIN™**. This includes: * **Compression Springs:** Provides precise pressure to ensure optimal contact between the heat sink and the component. * **Plastic/Brass Pins:** Designed to lock into pre-drilled holes on the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base: * **Type:** T766 (High performance) * **Function:** It fills microscopic air gaps between the heat sink and the chip to improve heat transfer. #### C. Straight Fin Design The fins are arranged in a vertical "Straight Fin" pattern. This is ideal for **forced air cooling** (fans) where the airflow direction is predictable. --- ### 3. Applications This heat sink is typically found in: * **Processors (CPUs/GPUs):** For small form-factor industrial PCs. * **FPGAs & ASICs:** High-heat programmable logic devices. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Telecommunications:** Used in routers and switches to manage heat in dense environments. --- ### 4. Thermal Performance Overview The efficiency of this part varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static) | 6.69 | | 300 (Moderate) | 1.74 | | 500 (High) | 1.03 |
    ✨ Follow-up Questions
    • ⤷How do I calculate the correct hole spacing for the pushPIN mounting?
    • ⤷ What is the difference between the C1 and C2 thermal interface materials?
    • ⤷ Can this heat sink be used in a natural convection environment?