ATS-07G-101-C2-R0
AI

The **ATS-07G-101-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height (Off Base)** | 30mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 6.69°C/W (at 100 LFM) |
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### 2. Key Features and Components
#### A. The pushPIN™ Attachment System
This part utilizes a specialized mounting mechanism called **pushPIN™**. This includes:
* **Compression Springs:** Provides precise pressure to ensure optimal contact between the heat sink and the component.
* **Plastic/Brass Pins:** Designed to lock into pre-drilled holes on the Printed Circuit Board (PCB).
#### B. Thermal Interface Material (TIM)
The "C2" in the part number indicates the type of thermal interface material pre-applied to the base:
* **Type:** T766 (High performance)
* **Function:** It fills microscopic air gaps between the heat sink and the chip to improve heat transfer.
#### C. Straight Fin Design
The fins are arranged in a vertical "Straight Fin" pattern. This is ideal for **forced air cooling** (fans) where the airflow direction is predictable.
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### 3. Applications
This heat sink is typically found in:
* **Processors (CPUs/GPUs):** For small form-factor industrial PCs.
* **FPGAs & ASICs:** High-heat programmable logic devices.
* **Power Supplies:** Cooling voltage regulators or power transistors.
* **Telecommunications:** Used in routers and switches to manage heat in dense environments.
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### 4. Thermal Performance Overview
The efficiency of this part varies based on the airflow (LFM - Linear Feet per Minute):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Static) | 6.69 |
| 300 (Moderate) | 1.74 |
| 500 (High) | 1.03 |
- ⤷How do I calculate the correct hole spacing for the pushPIN mounting?
- ⤷ What is the difference between the C1 and C2 thermal interface materials?
- ⤷ Can this heat sink be used in a natural convection environment?