The **ATS-07F-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number defines the physical and thermal characteristics of the unit: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Airflow Direction** | Vertical/Straight Fin | --- ### 2. Key Features * **maxiFLOW™ Design:** Features a graduated fin pattern that maximizes surface area for high-performance cooling while maintaining low pressure drop. * **pushPIN™ Attachment:** Includes a pre-assembled spring and pin system that provides the exact pressure required for optimal thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** Typically comes pre-applied with high-performance thermal grease (T766) to ensure effective heat transfer from the chip to the sink. * **Material properties:** Made from 6063 aluminum, which offers a balance of high thermal conductivity and structural integrity. --- ### 3. Dimensional Breakdown The "72" and "C2" in the part number refer to specific sizing and material configurations: * **Size:** 45.00mm x 45.00mm base. * **Height:** 12.70mm (Low profile for tight spaces). * **C2:** Indicates the specific attachment and thermal pad configuration (Blue Anodized with T766 TIM). --- ### 4. Typical Applications This heat sink is commonly used in: * **Network Switches:** Cooling ASICs and processors. * **Embedded Systems:** Industrial PCs where space is limited. * **Telecommunications:** Cooling radio frequency (RF) components.