The part number **ATS-07F-151-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 3.92°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series identifier. * **F**: Material/Configuration (Aluminum). * **151**: Size and geometry specific to this series. * **C2**: Thermal Interface Material (TIM). "C2" indicates **T766** phase-change material is applied to the base. * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink is a mechanical component, it serves critical electronic functions: 1. **Thermal Management**: It prevents the "thermal throttling" of electronic processors by dissipating heat into the ambient air. 2. **Increased Component Lifespan**: By keeping the junction temperature of a semiconductor low, it significantly reduces the rate of failure (based on the Arrhenius Law). 3. **Pressure Application**: The brass push-pin mechanism provides consistent pressure against the chip, ensuring a thin, uniform bond line with the Thermal Interface Material (TIM) for maximum heat transfer. --- ### 4. Implementation Details * **Mounting**: This part requires two holes pre-drilled into the PCB. The push-pins use a compression spring to hold the heat sink securely. * **Airflow**: Because it is a straight-fin design, it is optimized for systems with a specific direction of airflow (linear). * **Interface**: The pre-applied T766 material means no additional thermal paste is required during assembly.