The **ATS-06F-89-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.94°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 30.0mm | | **Fin Style** | Straight (High-density) | --- ### 2. Physical Design and Construction * **Heat Sink Material:** Constructed from high-quality aluminum for excellent thermal conductivity and lightweight properties. * **Fin Geometry:** The "F" in the part number indicates a specific fin pattern designed to maximize surface area for convective cooling. The 30mm height allows for significant heat dissipation in systems with sufficient vertical clearance. * **Finish:** The blue anodized coating protects the aluminum from oxidation and provides a small increase in emissivity for radiative cooling. ### 3. Attachment Mechanism (Push-Pin) The **Push-Pin** system used in this model is designed for secure mounting to a Printed Circuit Board (PCB). It includes: 1. **Spring-loaded Brass Pins:** These provide consistent pressure on the component to ensure a tight thermal bond. 2. **Pre-drilled Holes:** Requires the PCB to have specific hole patterns (spaced at 40.0mm in this series). 3. **Reliability:** Unlike adhesive tapes, push-pins offer a mechanical connection that is resistant to vibration and thermal cycling. ### 4. Thermal Performance Data Thermal resistance ($\theta$) measures the efficiency of the heat sink. Lower values indicate better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 11.52 | | 200 | 7.94 | | 300 | 6.33 | | 400 | 5.42 | | 500 | 4.83 | --- ### 5. Application Usage * **Target Components:** Large BGA (Ball Grid Array) packages, FPGAs, and microprocessors. * **Environmental Suitability:** Best used in forced-air environments (systems with fans) where the high-density fins can catch airflow.