The **ATS-06F-147-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series and is specifically designed for cooling electronic components like CPUs, GPUs, and high-power MOSFETs. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 13.52°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Pin Pitch** | 40.00mm (Center to Center) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The device utilizes a **Straight Fin** design. Straight fins are ideal for environments where airflow is consistent in a single direction. The blue anodized coating not only provides an aesthetic finish but also increases surface emissivity and protects the aluminum from corrosion. #### B. The Push-Pin Mechanism The part number indicates a specific attachment style: * **Spring-loaded Push-Pins:** These provide a secure, consistent pressure on the electronic component (IC), ensuring maximum heat transfer. * **Material:** The pins are typically made of brass or plastic; in this specific model (C2-R0), they are paired with high-tension springs to maintain contact even during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) The "R0" designation usually implies the inclusion of a pre-applied **Thermal Interface Material**. For this model, **T766** is used. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-06F-147-C2-R0 depends heavily on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 13.52 | | 400 (2.0 m/s) | 7.55 | | 600 (3.0 m/s) | 5.48 | | 800 (4.0 m/s) | 4.60 | --- ### 4. Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array chips found in networking equipment. * **Embedded Systems:** Used in industrial PCs where space is limited but heat dissipation is critical. * **Power Supplies:** Cooling voltage regulators or power transistors.