ATS-06F-07-C2-R0
AI

The **ATS-06F-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 17.00°C/W (@ 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Interface Material** | T766 (Thermal Grease) |
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### 2. Design Components
### A. Fin Geometry (Straight Fin)
The "06F" series utilizes a straight-fin design. These fins provide a high surface area to volume ratio, making them ideal for applications with consistent airflow (forced convection).
### B. pushPIN™ Attachment System
Unlike adhesive tapes or simple clips, the **pushPIN™** system ensures:
* **Mechanical Stability:** Uses a brass or plastic pin with a high-compression spring.
* **Constant Pressure:** Ensures the thermal interface material (TIM) remains in optimal contact with the heat source.
* **Pre-assembled:** Comes ready to install onto pre-drilled holes in the PCB.
### C. Thermal Interface Material (T766)
The unit comes with a pre-applied layer of **T766 phase-change material**. This eliminates the need for manual thermal paste application and ensures uniform coverage across the base of the heat sink.
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### 3. Usage Context
This specific electronic part is used in:
1. **Telecommunications:** Cooling network processors and ASICs.
2. **Embedded Systems:** Industrial PCs where height constraints (12.7mm) are a factor.
3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.
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### 4. Thermal Performance Comparison
*Performance varies based on airflow speed (LFM - Linear Feet per Minute):*
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 17.00 |
| 300 (Moderate) | 4.10 |
| 500 (High) | 2.56 |
- ⤷
How does the pushPIN™ attachment compare to thermal adhesive tape?
- ⤷ What are the PCB hole requirements for installing this heat sink?
- ⤷ Can the T766 thermal material be replaced with a different compound for higher performance?