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  • ATS-06F-07-C2-R0

  • AI
    The **ATS-06F-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 17.00°C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Design Components ### A. Fin Geometry (Straight Fin) The "06F" series utilizes a straight-fin design. These fins provide a high surface area to volume ratio, making them ideal for applications with consistent airflow (forced convection). ### B. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **pushPIN™** system ensures: * **Mechanical Stability:** Uses a brass or plastic pin with a high-compression spring. * **Constant Pressure:** Ensures the thermal interface material (TIM) remains in optimal contact with the heat source. * **Pre-assembled:** Comes ready to install onto pre-drilled holes in the PCB. ### C. Thermal Interface Material (T766) The unit comes with a pre-applied layer of **T766 phase-change material**. This eliminates the need for manual thermal paste application and ensures uniform coverage across the base of the heat sink. --- ### 3. Usage Context This specific electronic part is used in: 1. **Telecommunications:** Cooling network processors and ASICs. 2. **Embedded Systems:** Industrial PCs where height constraints (12.7mm) are a factor. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow speed (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 17.00 | | 300 (Moderate) | 4.10 | | 500 (High) | 2.56 |
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to thermal adhesive tape?
    • ⤷ What are the PCB hole requirements for installing this heat sink?
    • ⤷ Can the T766 thermal material be replaced with a different compound for higher performance?