The **ATS-06F-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. ### 1. Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-06F-06-C2-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Plastic or Brass) | | **Thermal Resistance** | 20.17°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The physical footprint of the heatsink is crucial for PCB layout planning: * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 10.00 mm (Low profile) * **Pitch (E/F):** 45.00 mm (Distance between mounting holes) --- ### 3. Key Features and Components #### A. pushPIN™ Attachment This part utilizes a specialized mounting system consisting of a spring-loaded pin. This ensures: * **Uniform Pressure:** Constant force is applied to the component, optimizing the thermal interface. * **Secure Fit:** Prevents the heatsink from shifting during vibration or shipping. * **Quick Assembly:** Requires pre-drilled holes in the PCB for rapid installation. #### B. Fin Design The heatsink features a **Fine-Pitch** design. The "06F" designation typically refers to the fin density and geometry. This design maximizes surface area for air-to-metal heat transfer within a compact 40x40mm footprint. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied **Thermal Phase Change Material** or high-performance adhesive on the base, ensuring there are no air gaps between the heatsink and the chip. --- ### 4. Typical Applications This specific heatsink is ideal for low-profile electronics where vertical space is limited but high cooling efficiency is required: * **Telecommunications:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and single-board computers (SBCs). * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 5. Thermal Performance Chart (Estimated) | Air Velocity (LFM) | 100 | 200 | 400 | 600 | |:---|:---|:---|:---|:---| | **Thermal Resistance (°C/W)** | 20.17 | 8.93 | 5.07 | 3.84 |