ATS-04H-71-C2-R0
AI

The **ATS-04H-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed to provide thermal management for electronic components, such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.69°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Flow** | Cross-flow capability |
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### 2. Key Features and Design
The ATS-04H-71-C2-R0 is part of the **pushPIN™** series, which focuses on ease of assembly and secure thermal contact.
* **Attachment Mechanism:** It uses a push-pin and spring mechanism. This ensures consistent pressure across the thermal interface material (TIM), preventing gaps between the component and the heat sink.
* **Thermal Performance:** The "straight fin" design is optimized for environments with forced air cooling. The material (AL6063) provides a good balance between thermal conductivity and weight.
* **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiant heat transfer.
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### 3. Electronic Application
This part is typically found in the following electronic environments:
1. **Network Hardware:** Cooling high-speed ASICs or FPGAs in switches and routers.
2. **Embedded Systems:** Industrial PCs where high-reliability mounting is required to withstand vibration.
3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs) or power converters.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 200 | 400 | 600 |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 6.69 | 2.50 | 1.41 | 1.03 |
- ⤷What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do I calculate the correct push-pin hole diameter for the PCB?
- ⤷ Are there copper versions of the ATS-71 series for higher heat dissipation?