The **ATS-04H-41-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It belongs to the **maxiFLOW™** product line, designed to optimize airflow and heat dissipation for electronic integrated circuits (ICs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass, 4-Node) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.02 °C/W (at 100 LFM) | | **Height** | 17.78 mm (0.7 inches) | | **Length / Width** | 40 mm x 40 mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Design #### A. The Heat Sink (maxiFLOW™) The body uses a **flared-fin design**, which increases the effective surface area for convective heat transfer while minimizing pressure drop. This design is particularly effective in high-velocity airflow environments. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-04H-41-C2-R0** uses mechanical push-pins. * **Security:** Provides consistent pressure to ensure the Thermal Interface Material (TIM) makes optimal contact with the chip. * **Reliability:** Resistant to shock and vibration, making it suitable for industrial or telecommunication equipment. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. This is a phase-change or high-performance pad that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 3. Electronic Applications This part is typically used for cooling the following types of electronic components: 1. **BGA (Ball Grid Array) Packages:** CPUs, GPUs, and high-end microcontrollers. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat during high-speed data processing. 3. **Network Switches:** Components in routers and server blades where airflow is directed. --- ### 4. Thermal Performance Data *As airflow increases (LFM - Linear Feet per Minute), the thermal resistance decreases:* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.02 | | 300 | 1.5 | 4.45 | | 500 | 2.5 | 3.32 |