The **ATS-04H-142-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *push-pin* attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 10.07°C/W (at 100 LFM) to 3.17°C/W (at 700 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Electronic Component Roles While the heat sink itself is a passive mechanical part, its electronic role is critical for the stability of the system: * **Thermal Dissipation:** It increases the surface area of a semiconductor package (like a BGA or FPGA), allowing heat to transfer more efficiently into the ambient air. * **Thermal Protection:** By maintaining a lower junction temperature ($T_j$), it prevents the electronic component from entering "thermal throttling" or permanent hardware failure. * **EMI Shielding (Secondary):** In some configurations, a grounded metal heat sink can provide a minor reduction in Electromagnetic Interference (EMI) radiating from the high-speed chip it covers. --- ### 3. Attachment Mechanism The **"C2"** in the part number indicates the specific attachment and thermal interface configuration: * **Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. They use a spring-loaded mechanism to ensure constant pressure between the heat sink and the chip. * **Thermal Interface Material (TIM):** This part comes pre-applied with high-performance thermal material to fill microscopic air gaps between the chip and the aluminum base, ensuring maximum heat transfer. --- ### 4. Airflow Performance Data Thermal resistance decreases as airflow (Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.07 | | 300 | 1.5 | 5.35 | | 500 | 2.5 | 3.97 | | 700 | 3.5 | 3.17 |