The **ATS-04H-137-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and high-power ICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 15.00mm x 15.00mm x 10.00mm | | **Attachment Type** | Push Pin (Standard) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 18.36°C/W (at 200 LFM) | | **Flow Orientation** | Vertical or Horizontal (depending on fins) | --- ### 2. Key Components & Electronics Context While a heat sink is a passive mechanical part, its role in an electronic system is critical for circuit stability. #### A. The Fin Design * **High Efficiency:** The "04H" series typically utilizes a cross-cut or pin-fin array. This maximizes surface area while allowing airflow from multiple directions. * **Low Profile:** At only 10mm high, it is designed for compact electronic assemblies where vertical space is limited. #### B. The Thermal Interface Material (TIM) * The "R0" suffix indicates that this part typically comes pre-applied with a **Thermal Interface Material**. * This material fills microscopic air gaps between the IC surface and the heat sink base to ensure maximum heat transfer. #### C. Mounting Mechanism (Push Pin & Spring) * **Pressure Consistency:** The use of springs ensures that a consistent downward force is applied to the electronic chip. * **Vibration Resistance:** Unlike simple adhesive tapes, push pins secure the heat sink to the PCB holes, making it suitable for industrial or automotive electronics subject to vibration. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) determines how much the component temperature rises per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.36 | | 400 (2.0 m/s) | 12.72 | | 600 (3.0 m/s) | 10.32 | --- ### 4. Typical Applications * **BGA Packaging:** Ideal for cooling Ball Grid Array (BGA) components. * **Network Switches:** Used on small microcontrollers or processing units in networking gear. * **Embedded Systems:** Suitable for Raspberry Pi-style modules or industrial PLCs.