The **ATS-04B-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-Pin (Spring Loaded) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM / 0.5 m/s) | | **Dimensions** | 45.00mm x 45.00mm | | **Height (Profile)** | 30.00mm | | **Fin Pitch** | Fine Pitch (High Density) | | **Thermal Interface** | T766 (Phase Change Material) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system provides a secure, tool-free connection to the PCB. The spring-loaded mechanism ensures consistent pressure (clamping force) for optimal heat transfer. * **T766 Pre-applied Thermal Material:** This is a high-efficiency thermal interface material (TIM) applied to the base, reducing the need for manual thermal paste application. * **Cross-Cut Design:** The fins are designed to facilitate airflow from multiple directions, making it efficient even in systems with non-linear airflow. * **Blue Anodized Finish:** Provides durability and protection against environmental factors while maintaining high thermal emissivity. --- ### 3. Application Use Cases This component is typically used in environments where electronic components generate significant heat but have limited space: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 4. **Processors:** Cooling small form factor (SFF) processors and logic chips. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as the airflow velocity increases: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **°C/W (Unducted)** | 6.69 | 3.65 | 2.85 | 2.45 | 2.20 |