ATS-01G-101-C3-R0
AI

The **ATS-01G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS).
Below is a detailed breakdown of its electronic and mechanical specifications.
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### 1. General Specifications
This part is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push Pin (Plastic or Copper) |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 100 LFM) |
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### 2. Physical Dimensions
Precision measurements are critical for PCB layout and ensuring no interference with surrounding electronic components.
| Dimension | Value (mm) |
| :--- | :--- |
| **Length (A)** | 40.00 mm |
| **Width (B)** | 40.00 mm |
| **Height (C)** | 30.00 mm |
| **Pin Pitch (E)** | 33.00 mm |
| **Pin Pitch (F)** | 33.00 mm |
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### 3. Thermal Performance Profile
The effectiveness of the heat sink varies based on the airflow (velocity) provided by the system's cooling fans.
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow (°C/W)** | 6.77 | 2.32 | 1.38 | 1.03 | 0.86 |
| **Ducted Flow (°C/W)** | 1.29 | 0.84 | 0.69 | 0.62 | 0.57 |
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### 4. Key Electronic Components Features
* **Attachment System:** It uses a specialized "Push Pin" and spring mechanism. This provides a constant, high-pressure contact between the heat sink and the electronic chip, improving the **Thermal Interface Material (TIM)** efficiency.
* **Thermal Interface:** This specific model usually comes pre-applied with high-performance thermal grease or a Phase Change Material (PCM) to ensure low thermal resistance between the component and the sink.
* **Fin Design:** It features a **Straight Fin** pattern, which is ideal for systems where airflow is predictable and directional.
* **EMI Shielding Compatibility:** The aluminum construction and anodized finish provide a level of durability and can be integrated into systems requiring specific grounding or EMI considerations.
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### 5. Part Number Breakdown
The nomenclature `ATS-01G-101-C3-R0` translates as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01:** Attachment Type (Push Pin).
* **G:** Spring Type.
* **101:** Specific design/fin geometry.
* **C3:** Material/Color (Aluminum / Blue Anodized).
* **R0:** Revision/Packaging code.
- ⤷
What is the difference between ducted and unducted thermal resistance?
- ⤷ How do I select the correct push pin size for my PCB thickness?
- ⤷ Can this heat sink be used with a 12V DC cooling fan?