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  • ATS-01F-41-C2-R0

  • AI
    The **ATS-01F-41-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Produced by **Advanced Thermal Solutions (ATS)**, this specific part belongs to the "push-pin" attachment series, which is popular for securing cooling solutions directly to Printed Circuit Boards (PCBs). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Fin Style** | Straight (Square) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 10.02°C/W (at 200 LFM) | | **Dimensions** | 40mm x 40mm x 25mm | | **Spring Type** | Compression Spring | --- ### 2. Design and Construction The "electronic" functionality of this part is passive, meaning it does not use electricity to operate, but its design is critical for the survival of active electronic components: * **Heat Dissipation:** The 25mm height and straight-fin design provide a large surface area. This allows heat generated by a processor or power transistor to be transferred to the surrounding air via convection. * **Push-Pin Attachment:** The part includes pre-drilled holes for push-pins. This mechanical connection ensures consistent pressure between the heatsink and the chip, which is vital for efficient heat transfer. * **Thermal Interface Material (TIM):** Typically, these parts come with a pre-applied thermal pad or require thermal grease. This fills the microscopic air gaps between the heatsink and the component. --- ### 3. Applications This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Power Supplies:** Managing heat in voltage regulators or MOSFETs. 3. **Embedded Systems:** Used on industrial PC motherboards or ARM-based processors. --- ### 4. Part Number Breakdown (ATS-01F-41-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **01F** | Series/Product Family (Push-Pin Heatsinks) | | **41** | Size Code (Approx 40-41mm footprint) | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant version | ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole sizes for the push-pin attachment on this heatsink?
    • ⤷ How does the thermal resistance of this part change with different airflow speeds (LFM)?
    • ⤷ Is there a specific thermal interface material (TIM) recommended for the ATS-01F-41-C2-R0?