ATS-01D-159-C1-R0
AI

The **ATS-01D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 2.07°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Fin Type** | XCUT (Cross-cut / Pin-fin) |
| **Pressure Type** | Low Pressure |
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## 2. Key Electronic Functions
### Heat Dissipation
In electronic circuits, components generate heat as a byproduct of electrical resistance. The ATS-01D-159-C1-R0 increases the **surface area** of the component it is attached to, allowing air to carry away heat more efficiently via convection.
### The pushPIN™ Attachment System
This specific model uses the **pushPIN™** system, which is critical for electronic PCB (Printed Circuit Board) assembly:
* **Precision:** Ensures uniform pressure across the component (like an FPGA or Processor).
* **Security:** Prevents the heat sink from shifting during vibration or shipping.
* **Hardware:** It typically includes a flexible spring and a plastic or brass pin that snaps into pre-drilled holes in the PCB.
### Thermal Interface Material (TIM)
The "R0" at the end of the part number usually signifies the inclusion of a specific **Thermal Interface Material** (like T412 or similar) pre-applied to the base. This material fills microscopic air gaps between the chip and the heat sink to maximize heat transfer.
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## 3. Physical Construction (XCUT Design)
The "XCUT" or cross-cut design allows for:
1. **Omni-directional Airflow:** Unlike straight-fin heat sinks, this design can receive cooling air from any direction.
2. **Weight Reduction:** Aluminum construction keeps the part lightweight to avoid mechanical stress on the PCB solder joints.
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- ⤷
What are the specific advantages of Blue Anodized finishing in thermal management?
- ⤷ How do I calculate if the 2.07°C/W thermal resistance is sufficient for my specific processor?
- ⤷ What are the PCB hole diameter requirements for the pushPIN™ attachment system?