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  • ATS-01D-159-C1-R0

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    The **ATS-01D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.07°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Type** | XCUT (Cross-cut / Pin-fin) | | **Pressure Type** | Low Pressure | --- ## 2. Key Electronic Functions ### Heat Dissipation In electronic circuits, components generate heat as a byproduct of electrical resistance. The ATS-01D-159-C1-R0 increases the **surface area** of the component it is attached to, allowing air to carry away heat more efficiently via convection. ### The pushPIN™ Attachment System This specific model uses the **pushPIN™** system, which is critical for electronic PCB (Printed Circuit Board) assembly: * **Precision:** Ensures uniform pressure across the component (like an FPGA or Processor). * **Security:** Prevents the heat sink from shifting during vibration or shipping. * **Hardware:** It typically includes a flexible spring and a plastic or brass pin that snaps into pre-drilled holes in the PCB. ### Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a specific **Thermal Interface Material** (like T412 or similar) pre-applied to the base. This material fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ## 3. Physical Construction (XCUT Design) The "XCUT" or cross-cut design allows for: 1. **Omni-directional Airflow:** Unlike straight-fin heat sinks, this design can receive cooling air from any direction. 2. **Weight Reduction:** Aluminum construction keeps the part lightweight to avoid mechanical stress on the PCB solder joints. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific advantages of Blue Anodized finishing in thermal management?
    • ⤷ How do I calculate if the 2.07°C/W thermal resistance is sufficient for my specific processor?
    • ⤷ What are the PCB hole diameter requirements for the pushPIN™ attachment system?