ATS-01D-126-C1-R0
AI

The **ATS-01D-126-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 54.00mm x 54.00mm |
| **Height** | 15.00mm |
| **Thermal Resistance** | 5.45°C/W (at 100 LFM) |
| **Attachment Method** | superGRIP (Clip-on) |
| **Airflow Path** | Straight Fin |
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### 2. Key Design Features
* **SuperGRIP™ Attachment:** This is a specialized mechanical attachment system. It uses a high-strength plastic frame that clips onto the component's PCB without requiring holes in the board. This is ideal for high-density layouts where drilling is impossible.
* **Straight Fin Geometry:** The fins are arranged in a parallel, straight configuration. This design is optimized for environments with consistent, directional airflow (forced convection).
* **Blue Anodized Finish:** Beyond aesthetics, the anodization process increases the surface emissivity and protects the aluminum from corrosion.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance phase-change material or thermal tape to ensure minimal air gaps between the heat sink and the chip.
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### 3. Application Use Cases
This specific heat sink is typically used in the following electronic systems:
1. **Telecommunications:** Cooling ASICs in routers and switches.
2. **Embedded Computing:** Managing heat in industrial-grade single-board computers.
3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 3.51 |
| 400 | 2.45 |
| 600 | 2.01 |
- ⤷How does the superGRIP attachment system compare to traditional push-pin mounts?
- ⤷ What is the importance of the Blue Anodized finish for thermal radiation?
- ⤷ Can this heat sink be used in natural convection environments?