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  • ATS-01D-126-C1-R0

  • AI
    The **ATS-01D-126-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 15.00mm | | **Thermal Resistance** | 5.45°C/W (at 100 LFM) | | **Attachment Method** | superGRIP (Clip-on) | | **Airflow Path** | Straight Fin | --- ### 2. Key Design Features * **SuperGRIP™ Attachment:** This is a specialized mechanical attachment system. It uses a high-strength plastic frame that clips onto the component's PCB without requiring holes in the board. This is ideal for high-density layouts where drilling is impossible. * **Straight Fin Geometry:** The fins are arranged in a parallel, straight configuration. This design is optimized for environments with consistent, directional airflow (forced convection). * **Blue Anodized Finish:** Beyond aesthetics, the anodization process increases the surface emissivity and protects the aluminum from corrosion. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance phase-change material or thermal tape to ensure minimal air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic systems: 1. **Telecommunications:** Cooling ASICs in routers and switches. 2. **Embedded Computing:** Managing heat in industrial-grade single-board computers. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 3.51 | | 400 | 2.45 | | 600 | 2.01 |
    ✨ Follow-up Questions
    • How does the superGRIP attachment system compare to traditional push-pin mounts?
    • What is the importance of the Blue Anodized finish for thermal radiation?
    • Can this heat sink be used in natural convection environments?