The **ATS-01D-125-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 8.92°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 30.00mm | | **Pitch** | Fine Pitch (Optimized for airflow) | --- ### Key Components & Design Features 1. **Heat Sink Body (Aluminum 6063):** The main body is made from high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity and lightweight properties. The blue anodized finish provides corrosion resistance and increases emissivity. 2. **Push-Pin Attachment:** This model utilizes a **push-pin** system for mounting. These are plastic or metal pins with a pre-installed spring that snaps into pre-drilled holes on the Printed Circuit Board (PCB). This ensures constant pressure for better thermal contact. 3. **Thermal Interface Material (TIM):** The "R0" designation typically indicates that the heat sink comes with a pre-applied high-performance Thermal Interface Material (usually **T766**). This fills the microscopic air gaps between the component and the heat sink base. 4. **Straight Fin Design:** The fin geometry is designed for maximum surface area. This specific model uses a "Straight Fin" configuration, which is ideal for systems with a defined airflow direction (forced convection). --- ### Part Number Breakdown (Nomenclature) Understanding the code helps identify its specific configuration: * **ATS:** Advanced Thermal Solutions (Brand). * **01:** pushPIN™ series. * **D:** Part of the dimension/footprint categorization. * **125:** Specific physical size/configuration ID. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Thermal Interface Material (TIM) type and revision. --- ### Typical Applications * **Integrated Circuits (ICs):** Used on high-speed processors or FPGAs. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Networking Equipment:** Routers and switches that require passive or active cooling in cramped environments.