The **ATS-01D-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 3.20°C/W (at 100 LFM) | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height (Off Base)** | 20.00mm | | **Pin Pitch** | 43.00mm | --- ### 2. Design and Component Breakdown #### A. The Fin Design (Cross-Cut) The "124" in the part number indicates a specific fin pattern. This heat sink uses a **straight-fin or cross-cut design**, which maximizes surface area while allowing airflow from multiple directions. This is critical in cramped PCB environments where air movement might be turbulent. #### B. The pushPIN™ Attachment Unlike adhesive-based heat sinks, the **R0** suffix denotes the use of a mechanical push-pin system: * **Spring-loaded mechanism:** Provides consistent pressure (preload) against the component, ensuring a tight thermal interface. * **Reliability:** Mechanical fasteners are preferred in high-vibration environments compared to thermal tape. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the emissivity of the surface, slightly improving heat radiation and providing corrosion resistance. --- ### 3. Thermal Performance Profile The efficiency of the ATS-01D-124-C2-R0 depends heavily on the Air Velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.20 | | 300 (1.5 m/s) | 1.59 | | 500 (2.5 m/s) | 1.25 | | 700 (3.5 m/s) | 1.08 | --- ### 4. Component Application This part is typically used on **Mid-range Power Components** such as: 1. **Telecommunications gear:** Routers and switches. 2. **Industrial PCs:** Embedded systems requiring passive or active cooling. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators.