The **ATS-01D-121-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.56°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Fine Pitch (straight fins) | | **TIM (Thermal Interface Material)** | T412 (applied to base) | --- ### 2. Key Component Breakdown #### A. Thermal Interface Material (TIM) The "C3" in the part number indicates that it comes pre-applied with **T412 thermal tape**. This is a high-performance adhesive that eliminates the need for external clips or screws while ensuring efficient heat transfer from the component to the aluminum fins. #### B. pushPIN™ Attachment This model utilizes a mechanical mounting system known as pushPIN™. * **Purpose:** Provides consistent pressure to ensure the TIM makes full contact with the chip surface. * **Hardware:** It typically uses brass or plastic pins with stainless steel springs to lock into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Airflow Performance The thermal resistance of this part varies significantly based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.56 | | 300 (1.5 m/s) | 5.12 | | 500 (2.5 m/s) | 4.10 | --- ### 3. Part Number Decoder The part number **ATS-01D-121-C3-R0** can be broken down as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01D:** Series/Designation. * **121:** Specific dimension/fin configuration code. * **C3:** Material/TIM code (Aluminum + T412 tape). * **R0:** Revision or packaging code. --- ### 4. Applications This heat sink is commonly found in: * **Networking Equipment:** Routers and switches with high-speed processing chips. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Cooling voltage regulators or MOSFETs.